On March 17, 2020, Ma Liang, Party Secretary of the District Committee of the Communist Party of China (CPC), visited Jiangsu Kemaite Technology Development Co., Ltd. for an investigation to learn more about the advanced manufacturing industry along the lakeside.

This research is divided into two parts. First of all, General Manager of Jiangsu Kemaite Technology Development Company led Secretary Ma Liang and his party to visit the production and laboratory of the company.

After the visit, Secretary Ma Liang and General Manager Yu Jiazhen had a discussion and exchange meeting on the current situation of the company.

At the meeting, the current situation of the company and the problems encountered in the operation were deeply exchanged. And answered the enterprise concerned about the development space, regional planning, policy support and other issues.

Our company is the first domestic manufacturer to introduce foreign advanced technology and equipment of shielding aluminum plastic film composite materials, and independent research and development of integrated circuit chip packaging flexible functional composite film and other new materials, is expected to replace imported products. At the same time, Ma Liang said at the meeting, the integrated circuit industry is the national key development industry, but also the pillar industry of Binhu, encourage enterprises to seize the development opportunities, firm the confidence and determination of scientific and technological research and development, continue to increase investment in research and development, improve the ability and level of independent innovation, become an important link of the integrated circuit industry chain.

In the future development, our company will continue to upgrade and iterate products through independent innovation, take a good development route of high, fine and sophisticated, consolidate the existing market share, expand the market space in more fields, and forge ahead toward the goal of leading the industry. Electromagnetic shielding, chip packaging, thermal management system.